FPGA Solutions-AMD Chipset

AMD Packages Enzotech solutions Heat sink Rth
Number LxW Chip set thickenss Part Number Fin/pin Shape Max. Height LxW
8151TM AGP Tunnel 31 2.75 MPA31-33/3.1Y Pin 33.1 31 reference
MWA31-33/3.1Y Elliptic 33.1 reference
8131TM PCI-X Tunnel 37.5 2.85 MPA37.5-33/3.0Y Pin 33.0 37.5 reference
MWA37.5-33/3.0Y Elliptic 33.0 reference
766TM Peripheral Bus Controller 27 1.70 MPA27-33/2.6BU Pin 32.6 27 reference
MWA27-33/2.6BU Elliptic 32.6 reference
HA27-13BU Line 12.5 reference
761TM System Controller 37.5 1.70 MPA37.5-33/2.6BU Pin 32.6 37.5 reference
MWA37.5-33/2.6BU Elliptic 32.6 reference
HA37.5-13BU Line 12.5 reference
8111TM Hyper TransportTM I/O Hub 35 1.70 MPA35-33/2.6BU Pin 32.6 35 reference
MWA35-33/2.6BU Elliptic 32.6 reference
HA35-13BU Line 12.5 reference
8132TM Hyper TransportTM PCI-X 2.0 Tunnel Data Sheet 35 1.70 MPA35-33/2.6BU Pin 32.6 35 reference
MWA35-33/2.6BU Elliptic 32.6 reference
HA35-13BU Line 12.5 reference